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Surface analysis at the sidewalls of VLSI patterns—limitations and capabilities of spatially resolved Auger electron spectroscopy

✍ Scribed by W. Hösler


Publisher
John Wiley and Sons
Year
1991
Tongue
English
Weight
863 KB
Volume
17
Category
Article
ISSN
0142-2421

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✦ Synopsis


Abstract

Spatially defined excitation by a confined primary electron beam is the basis of conventional scanning Auger microscopy. This method encounters a physical limitation in spatial resolution when it is used for the analysis of sidewall surface of micron‐ and submicron‐sized patterns on VLSI semiconductor devices. The limitation arises from scattered primary electrons, which drastically reduce the analytically usable spatial resolution whenever protruding features of the specimen topography are irradiated by the primary beam. A non‐conventional approach to improve the selectivity for surfaces of special orientation is presented, making use of the characteristic angular distribution of Auger electron emitted from surfaces. It is shown that by an appropriate modification of the angular spectrometer acceptance, the analytical resolution of sidewalls of VLSI patterns can be increased by more than one order of magnitude.