Sub-micron ablation of metallic thin film by femtosecond pulse laser

✍ Scribed by K. Venkatakrishnan; B. Tan; N.R. Sivakumar

• Publisher: Elsevier Science
• Year: 2002
• Tongue: English
• Weight: 264 KB
• Volume: 34
• Category: Article
• ISSN: 0030-3992
• DOI: 10.1016/s0030-3992(02)00074-9

✦ Synopsis

The ability to machine very small features in a material has a wide range of applications in industry. We ablated holes into thin ÿlm of 100 nm thickness made from various metals by femtosecond pulsed laser ablation. Using a Ti:Sapphire laser which supplies a laser pulse of 150 fs duration at central spectrum wavelength of 400 nm, we have produced a series sub-micron holes, whose diameters are less than 200 nm with a focused laser spot of 1:7 m. We found that the material damage threshold has a great in uence on the quality of the produced features. Experimental results shows that the heat-a ected zone and the degree of being a ected reduce with the increase of threshold value.