Study on the curing reaction, dielectric and thermal performances of epoxy impregnating resin with reactive silicon compounds as new diluents

✍ Scribed by Yun Zheng; Kim Chonung; Xiaolin Jin; Ping Wei; Pingkai Jiang

• Publisher: John Wiley and Sons
• Year: 2007
• Tongue: English
• Weight: 559 KB
• Volume: 107
• Category: Article
• ISSN: 0021-8995
• DOI: 10.1002/app.27502