Study on contact angles of Au, Ag, Cu, Sn, Al and Al alloys to SiC

✍ Scribed by Sennosuke Takahashi; Osamu Kuboi

• Publisher: Springer
• Year: 1996
• Tongue: English
• Weight: 372 KB
• Volume: 31
• Category: Article
• ISSN: 0022-2461
• DOI: 10.1007/bf00372193

✦ Synopsis

Contact angles of Au, Ag, Cu, Sn, AI and AI alloys to SiC were measured by use of sessile drops heated by a high frequency induction coil designed to be convex against the SiC plate. Three crystal configurations of a-SiC, polycrystalline plane of sintered SiC, SiC (1 1 1) plane, and SiC (1000) plane were used as base plates. Au, Sn, Ai and AI alloys showed a large contact angle of about 150 o at each melting temperature, however those of Ag and Cu were in the range of 105-121 ~ . Every contact angle of AI and its alloys decreased to under 90 ~ when held at 1350~ SiC (1000) plane gave a lower contact angle than the other two SiC planes for Cu, AI and AI-Si alloys.