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Study of Variation in Pore Diameter with Etching Rate and Fabrication of Copper Nano/Micro Wires Using Electrodeposition Method

✍ Scribed by Kaur, Harmanmeet; Singh, Surinder; Kaur, Jaskiran; Kumar, Rajesh


Book ID
115499242
Publisher
Taylor and Francis Group
Year
2012
Tongue
English
Weight
611 KB
Volume
51
Category
Article
ISSN
0360-2559

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