Study of thickness and grain size effects on material behavior in micro-forming

✍ Scribed by Fung-Huei Yeh; Ching-Lun Li; Yuung-Hwa Lu

• Publisher: Elsevier Science
• Year: 2008
• Tongue: English
• Weight: 671 KB
• Volume: 201
• Category: Article
• ISSN: 0924-0136
• DOI: 10.1016/j.jmatprotec.2007.11.138

✦ Synopsis

With the development of the technology, miniature and portability become the trends in manufacturing business. It is more and more important to miniaturize blank size in microforming process as well. Therefore, the researchers of micro-forming focus on this trend and try their best to study the problems and find the best solution. This paper presents an effective and practical mathematical modeling to describe the material behavior of any thickness and any grain size in micro-forming. Using this modeling, the cylindrical microcup deep drawing is analyzed by explicit dynamic finite element method. The simulation results show that thickness variety and stress distribution are reasonable. This investigation proves that the new mathematical modeling of material behavior will supply a useful modeling which takes into account the thickness and grain size effects in micro-forming.