Study of surface integrity using the small area EDM process with a copper–tungsten electrode

✍ Scribed by Hwa-Teng Lee; Fu-Chuan Hsu; Tzu-Yao Tai

• Publisher: Elsevier Science
• Year: 2004
• Tongue: English
• Weight: 575 KB
• Volume: 364
• Category: Article
• ISSN: 0921-5093
• DOI: 10.1016/j.msea.2003.08.046