✦ LIBER ✦
Study of silicon backside damage in deep reactive ion etching for bonded silicon–glass structures
✍ Scribed by Y. Yoshida; M. Kumagai; K. Tsutsumi
- Publisher
- Springer-Verlag
- Year
- 2003
- Tongue
- English
- Weight
- 189 KB
- Volume
- 9
- Category
- Article
- ISSN
- 0946-7076
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