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Study of interfacial reactions between Tin and copper by differential scanning calorimetry

✍ Scribed by S. K. Kang; S. Purushothaman

Book ID
107457679
Publisher
Springer US
Year
1998
Tongue
English
Weight
675 KB
Volume
27
Category
Article
ISSN
0361-5235

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In this paper, the solid-state interactions between a 500 nm thick Ni layer and a Si wafer are studied for temperatures up to 500 Β°C by coupling Differential Scanning Calorimetry (DSC) and Transmission Electron Microscopy (TEM). The phase transformation temperatures determined by DSC are about 250,