✦ LIBER ✦
Study and improvement of electrical performance of 130 nm Cu/CVD low k SiOCH interconnect related to via etch process
✍ Scribed by C.F. Tsang; V.N. Bliznetsov; Y.J. Su
- Book ID
- 104050848
- Publisher
- Elsevier Science
- Year
- 2003
- Tongue
- English
- Weight
- 548 KB
- Volume
- 34
- Category
- Article
- ISSN
- 0026-2692
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