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Studies on electrolytic Cu-Ni alloy plating

✍ Scribed by R.D. Srivastava; A.K. Agarwal; R. Sharma


Publisher
Elsevier Science
Year
1979
Weight
331 KB
Volume
9
Category
Article
ISSN
0376-4583

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A mathematical model, predicting the influence of a citrate complexant in the electrodeposition of copper-nickel alloys, was developed. The model which takes into account the deposition of complexed and uncomplexed species is based on convective-diffusion transport and Butler-Volmer reaction kinetic