Studies of bonding mechanisms and failure modes in thermocompression bonds of gold-plated leads to Ti-Au metallized substrates : A. T. English and J. L. Hokanson, Proc. IEEE Reliab. Phys. Symp., Las Vegas, U.S.A. 31 March–2 April (1971)

• Publisher: Elsevier Science
• Year: 1971
• Tongue: English
• Weight: 104 KB
• Volume: 10
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(71)90138-7