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Structural investigations of gold-to-gold wafer bonding interfaces

✍ Scribed by Hyoun Woo Kim; Nam Ho Kim

Book ID: 108215053
Publisher: Elsevier Science
Year: 2004
Tongue: English
Weight: 286 KB
Volume: 110
Category: Article
ISSN: 0921-5107
DOI: 10.1016/j.mseb.2004.03.004

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