Structural Analysis of Printed Circuit Board Systems

✍ Scribed by Peter A. Engel (auth.)

• Publisher: Springer-Verlag New York
• Year: 1993
• Tongue: English
• Leaves: 306
• Series: Mechanical Engineering Series
• Edition: 1
• Category: Library

✦ Synopsis

This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.

✦ Table of Contents

Front Matter....Pages i-xix
Elements of Structural Analysis....Pages 1-20
Finite Element Analysis....Pages 21-34
Components, Data, and Testing....Pages 35-60
Leadless Chip Carriers....Pages 61-76
Thermal Stress in Pin-Grid Arrays: Primary Analysis of Pins....Pages 77-96
Thermal Stress in Pin-Grid Arrays: Interaction Between Module and Circuit Card....Pages 97-115
Compliant Leaded Systems: The Local Assembly....Pages 116-135
Bending in Compliant Leaded Systems....Pages 136-162
Approximate Engineering Theory for the Twisting of Compliant Leaded Circuit Card/Module Systems....Pages 163-178
Analytical Theory and Experimental Work in Compliant Leaded Systems Subjected to Twisting....Pages 179-202
Thermal Stresses in Compliant Leaded Systems....Pages 203-225
Dynamic Response of Circuit Card Systems....Pages 226-242
Plated Holes in Cards and Boards....Pages 243-259
Assembly of Cards and Boards....Pages 260-281
Back Matter....Pages 283-291

✦ Subjects

Mechanics;Characterization and Evaluation of Materials;Electronics and Microelectronics, Instrumentation