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Stresses and interfacial structure in Au–Ni and Ag–Cu metallic multilayers

✍ Scribed by S. Labat; F. Bocquet; B. Gilles; O. Thomas

Book ID
113894885
Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
354 KB
Volume
50
Category
Article
ISSN
1359-6462

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✍ H. Y. Wang; R. Najafabadi; D. J. Srolovitz; R. Lesar 📂 Article 📅 1993 🏛 Springer 🌐 English ⚖ 1021 KB

Atomistic simulations of segregation to [001] $5 twist boundaries in Cu-Ni, Au-Pd, and Ag-Au alloy systems have been performed for a wide range of temperatures and compositions within the solid solution region of these alloy phase diagrams. In addition to the grain boundary segregation profiles, gra