✦ LIBER ✦
Stress migration risk on electromigration reliability in advanced narrow line copper interconnects
✍ Scribed by Heryanto, A.; Pey, K. L.; Lim, Y. K.; Raghavan, N.; Liu, W.; Wei, J.; Gan, C. L.; Tan, J. B.
- Book ID
- 111871371
- Publisher
- American Institute of Physics
- Year
- 2011
- Tongue
- English
- Weight
- 838 KB
- Volume
- 110
- Category
- Article
- ISSN
- 0021-8979
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