✦ LIBER ✦
Stress induced voids in aluminum interconnects during IC processing : J. T. Yue, W. P. Funsten and R. V. Taylor. 23 a. Proc. Reliab. Phys. Symp. 126 (1985)
- Publisher
- Elsevier Science
- Year
- 1986
- Tongue
- English
- Weight
- 135 KB
- Volume
- 26
- Category
- Article
- ISSN
- 0026-2714
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