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Stress in copper electrodeposits from the sulphate bath

โœ Scribed by R. Walker; A. Ward


Publisher
Elsevier Science
Year
1970
Tongue
English
Weight
476 KB
Volume
15
Category
Article
ISSN
0013-4686

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Cylindrical cathodes containing microgrooves of various widths and depths were electrodeposited with copper from a cyanide copper bath. The uniformity ratio, hr/h ~ (where h r is the thickness of deposit on the recess of a groove, and h~ a similar parameter for the peak), was measured in a microscop