Stress evolution during and after sputter deposition of Cu thin films onto Si (100) substrates under various sputtering pressures

✍ Scribed by Pletea, M.; Brückner, W.; Wendrock, H.; Kaltofen, R.

• Book ID: 120505779
• Publisher: American Institute of Physics
• Year: 2005
• Tongue: English
• Weight: 701 KB
• Volume: 97
• Category: Article
• ISSN: 0021-8979
• DOI: 10.1063/1.1858062