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Stress dependence of creep in bonded adhesives

โœ Scribed by Edward J. Hughes; John L. Rutherford


Publisher
Elsevier Science
Year
1980
Weight
454 KB
Volume
44
Category
Article
ISSN
0025-5416

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The tensile creep characteristics of den
โœ Cruickshanks-Boyd, D. W. ;Roswati, N. ๐Ÿ“‚ Article ๐Ÿ“… 1981 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 470 KB

## Abstract Equipment is described which enables the determination of the creep behavior of small specimens of dental amalgam under tensile stresses. The apparatus has been used to measure the creep strain of both low and high copper dental amalgams at 34ยฐC, in the stress range 9.4 to 38.8 MNm^โˆ’2^,