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Strain-measurement methods as a forecasting factor for the behavior of semiconductor thermoelements under extreme temperatures

✍ Scribed by E. K. Iordanishvili; Kh. O. Olimov; Yu. I. Ravich


Publisher
Springer US
Year
1987
Tongue
English
Weight
261 KB
Volume
53
Category
Article
ISSN
1573-871X

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