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Static sealing element


Book ID
117749808
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
197 KB
Volume
2012
Category
Article
ISSN
1350-4789

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This invention relates to a method for hermetically encapsulating an electronic component that is mounted in flip-chip design on a support. The method described is characterized by first covering the component with a film, which closely rests on the component and the support, then structuring the fi

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