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Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition

✍ Scribed by L. Kunz; P. Lukáš; L. Pantělejev; O. Man

Book ID
111201939
Publisher
John Wiley and Sons
Year
2010
Tongue
English
Weight
980 KB
Volume
47
Category
Article
ISSN
0039-2103

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