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Sputtering of tantalum-based diffusion barriers in SiCu metallization: effects of gas pressure and composition

✍ Scribed by M. Stavrev; C. Wenzel; A. Möller; K. Drescher


Publisher
Elsevier Science
Year
1995
Tongue
English
Weight
662 KB
Volume
91
Category
Article
ISSN
0169-4332

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