Spin-on-glass (SOG) process-induced tungsten residue in a semiconductor manufacturing procedure

✍ Scribed by Ping Hsun Chen; Tate Chen; Han Chang Shih

• Publisher: Elsevier Science
• Year: 2004
• Tongue: English
• Weight: 335 KB
• Volume: 35
• Category: Article
• ISSN: 0026-2692
• DOI: 10.1016/j.mejo.2004.06.021

✦ Synopsis

In this article, a case of Spin-on-Glass (SOG) process-induced tungsten residue was reported. The case was found after the tungsten etchback process of filling vias. A possible failure mechanism was proposed. Based on the review of our process flow, it is believed that the tungsten residue might result from the hydrodynamic effects of SOG.