SPIE Proceedings [SPIE SPIE Defense, Security, and Sensing - Baltimore, Maryland, USA (Monday 29 April 2013)] Flexible Electronics - Flexible packaging and integration of CMOS IC with elastomeric microfluidics

✍ Scribed by Zhang, Bowei; Dong, Quan; Korman, Can E.; Li, Zhenyu; Zaghloul, Mona E.; Allee, David R.; Forsythe, Eric W.

• Book ID: 120518808
• Publisher: SPIE
• Year: 2013
• Weight: 983 KB
• Volume: 8730
• Category: Article
• DOI: 10.1117/12.2015554