Special Issue on PCB Level Signal Integrity, Power Integrity, and EMC

Special issue on PCB level signal integr

Special issue on PCB level signal integrity, power integrity and EMC

📂 Article 📅 2009 🏛 IEEE 🌐 English ⚖ 124 KB

[IEEE 2013 17th IEEE Workshop on Signal

[IEEE 2013 17th IEEE Workshop on Signal and Power Integrity (SPI) - Paris, France (2013.05.12-2013.05.15)] 2013 17th IEEE Workshop on Signal and Power Integrity - Fast estimation of high-speed signal integrity for coupled PCB interconnects

✍ Eudes, Thomas; Ravelo, Blaise; Lacrevaz, Thierry; Flechet, Bernard 📂 Article 📅 2013 🏛 IEEE ⚖ 209 KB

Electrical Modeling and Design for 3D Sy

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Introduction

✍ Li, Er-Ping 📂 Article 📅 2012 🏛 John Wiley & Sons, Inc. 🌐 English ⚖ 277 KB

**New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems** Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity a

Electrical Modeling and Design for 3D Sy

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Index

✍ Li, Er-Ping 📂 Article 📅 2012 🏛 John Wiley & Sons, Inc. 🌐 English ⚖ 40 KB

**New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems** Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity a

Editorial for special issue on structura

Editorial for special issue on structural integrity and failure

✍ Dr Alan K. Hellier; Dr Ashvin Thambyah; Professor W. George Ferguson 📂 Article 📅 2011 🏛 John Wiley and Sons 🌐 English ⚖ 437 KB

Electrical Modeling and Design for 3D Sy

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Front Matter

✍ Li, Er-Ping 📂 Article 📅 2012 🏛 John Wiley & Sons, Inc. 🌐 English ⚖ 131 KB

**New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems** Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity a