Spatial domain Green's functions for planar multilayered structures

✍ Scribed by K. L. Lai; L. Tsang; C. C. Huang

• Publisher: John Wiley and Sons
• Year: 2004
• Tongue: English
• Weight: 132 KB
• Volume: 44
• Category: Article
• ISSN: 0895-2477
• DOI: 10.1002/mop.20555

✦ Synopsis

show variations of 3 dB. Taking into account this result, it appears that the waveguide interconnects are the main source of variation. However, the major uncertainty in the fabrication does not stem from the demanding mechanical tolerances, which have been met very precisely, but rather from the conductive bonding of the substrates to the carrier plate. This cannot be carried out with sufficient reproducibility and uniformity in the manual fabrication process employed. A significant improvement is expected when using stamped conductive-bonding film and a professional multilayer press.

The conversion gain variations are compensated for by individual adjustment of digitally programmable attenuators in the IF circuitry. Additionally, a final correction of element gain and phase errors is applied in the digital circuitry.

5. CONCLUSION

A novel highly integrated 4 ϫ 4 receiver array module for digital beamforming in the Ka-band has been designed and fabricated. It incorporates 16 antenna elements, together with individual analog heterodyne receiver circuits, all packaged in a compact module of 30 ϫ 30 ϫ 92 mm 3 size, thus allowing us to array several modules in order to form a complete terminal. The first measurement results from the fabricated prototype module prove the functionality of the packaging concept. Critical issues, for example, the fabrication of the waveguide interconnects, have been identified and will be the subject of further optimization.