Spacecraft Thermal Control Handbook: Fundamental Technologies

✍ Scribed by David G. Gilmore

• Publisher: AIAA (American Institute of Aeronautics & Ast
• Year: 2002
• Tongue: English
• Leaves: 836
• Edition: 2
• Category: Library

✦ Synopsis

This new edition of the classic Satellite Thermal Control Handbook, is a thorough, technical survey of the various technologies used to achieve thermal control of all types of spacecraft, as well as the design and analysis methods used by thermal engineers. Features: Spacecraft Systems Overview; Spacecraft Thermal Environments; Thermal Design Examples; Thermal Surface Finishes; Insulation; Radiators; Heaters; Mounting and Interfaces; Louvers; Heat Switches; Phase Change Materials; Pumped Fluid Loops; Thermoelectric Coolers; Heat Pipes; Thermal Design Analysis; Thermal Contact Resistance; Precision Temperature Control; Space Shuttle Integration; Thermal Testing; Future Technologies

✦ Table of Contents

Front Matter......Page 1
Acknowledgements......Page 4
Contributing Authors......Page 5
Preface......Page 3
Table of Contents......Page 0
Table of Contents......Page 9
1.2 Spacecraft Configurations......Page 14
1.3 Earth Orbits......Page 20
1.4 Interplanetary Orbits......Page 24
1.5 Missions......Page 28
2.1 Environments of Earth Orbit......Page 34
2.2 Standard Earth Orbits......Page 49
2.3 Environments of Interplanetary Missions......Page 61
2.4 Aerobraking Environments......Page 73
2.5 Launch and Ascent Environments......Page 76
2.6 References......Page 80
3.2 Spin-Stabilized Satellites......Page 83
3.3 Three-Axis-Stabilized Satellites......Page 84
3.4 Propulsion Systems......Page 85
3.5 Batteries......Page 89
3.6 Antennas......Page 91
3.7 Sun, Earth, and Star Sensors......Page 93
3.8 Cooled Devices......Page 96
3.9 Solar Arrays......Page 98
3.10 The Huygens Probe......Page 99
3.11 System Overview: The Hubble Space Telescope......Page 107
4.2 Common Thermal Surface Finishes......Page 150
4.3 Causes of Thermal Surface Degradation......Page 154
4.4 Degradation Rates for Common Thermal Finishes......Page 163
4.5 LDEF Results......Page 166
4.6 Electrical Grounding......Page 169
4.7 References......Page 170
5.1 Introduction......Page 171
5.2 Blanket Performance......Page 172
5.4 Materials......Page 179
5.5 Provisions for Venting......Page 192
5.6 Attachments......Page 193
5.7 Provisions for Electrical Grounding......Page 196
5.8 Fabrication......Page 197
5.10 High-Temperature Blankets......Page 203
5.11 Suggestions......Page 204
5.12 Insulation for In-Atmosphere Applications......Page 208
5.13 References......Page 215
6.1 Introduction......Page 216
6.4 Body-Mounted Radiators......Page 218
6.5 Deployable Radiators......Page 220
6.6 Radiator Freezing......Page 224
6.7 Radiator Effectiveness......Page 226
6.8 Experimental Radiators......Page 229
6.9 References......Page 231
7.2 Heater Types......Page 232
7.3 Control......Page 233
7.4 Failure Modes of Mechanical Thermostats......Page 236
7.5 Circuits......Page 237
7.6 Computer-Controlled Heater System Example......Page 240
7.7 Radioisotope Heater Units......Page 250
8.2 Unit Conduction Cooling......Page 255
8.3 Bolted-Joint Conductance without Interface Filler......Page 268
8.4 Bolted-Joint Conductance with Interface Filler......Page 283
8.5 Complex Configurations and Special Topics......Page 292
8.6 Nomenclature......Page 328
8.7 References......Page 331
9.1 Introduction......Page 338
9.2 Vane Louvers......Page 339
9.3 Analysis of Vane Louvers......Page 342
9.4 Designing Louvers for Operation in Sunlight......Page 353
9.5 Pinwheel Louvers......Page 356
9.6 References......Page 359
10.1 Introduction......Page 360
10.2 Heat-Switch Applications......Page 361
10.3 Heat-Switch Integration......Page 362
10.4 Paraffin Heat Switches......Page 364
10.5 Cryogenic Heat Switches......Page 373
10.6 References......Page 377
11.1 Phase-Change-Material Applications......Page 379
11.2 Phase-Change Materials......Page 383
11.3 When To Use a PCM......Page 386
11.4 PCM Design Details......Page 389
11.6 References......Page 408
12.1 Introduction......Page 410
12.2 Fluid-Flow Concepts and Basic Equations......Page 412
12.3 Forced Convection in Pipes and Tubes......Page 420
12.4 System Hardware......Page 423
12.5 Analysis of a Fluid Loop......Page 447
12.6 Computer Software for System Analysis......Page 448
12.7 PFL Application......Page 449
12.8 References......Page 473
13.2 Background......Page 478
13.3 Characteristics......Page 480
13.4 Optimizations......Page 481
13.6 Interfaces......Page 483
13.7 XRT Focal-Plane TEC Mounting......Page 484
13.8 Design Development......Page 485
13.10 Application Example......Page 486
13.11 Reference......Page 492
14.1 Overview......Page 493
14.2 Types of Heat Pipe......Page 494
14.3 Analysis......Page 500
14.4 Testing......Page 504
14.5 Heat-Pipe Applications and Performance......Page 505
14.7 LHPs and CPLs......Page 506
14.8 Selecting a Design......Page 522
14.9 References......Page 525
15.2 Spacecraft Project Phases......Page 527
15.3 Thermal Design/Analysis Process Overview......Page 538
15.4 Fundamentals of Thermal Modeling......Page 541
15.5 Thermal Design Analysis Example: POAM......Page 556
15.6 Margins......Page 576
15.7 TMM Computer Codes......Page 579
15.8 Radiation Analysis Codes......Page 596
15.9 References......Page 601
16.1 Introduction......Page 603
16.2 Contact Heat-Transfer Background......Page 604
16.3 Parameters Influencing Thermal Joint Resistance......Page 606
16.4 Thermal Joint Resistance Models......Page 607
16.5 The Effect of Oxidation on Thermal Contact Resistance......Page 627
16.6 The Effect of Interstitial Materials on Thermal Contact Resistance......Page 630
16.7 References......Page 640
17.1 Introduction......Page 643
17.2 The Space Interferometry Mission......Page 644
17.3 The Hydrogen Maser Clock......Page 659
17.5 References......Page 670
18.1 Introduction......Page 671
18.2 Engineering-Compatibility Assessment......Page 673
18.3 Safety Assessment......Page 679
18.4 The Cargo Integration Review......Page 680
18.5 Orbiter Payload-Bay Thermal Environment......Page 681
18.6 Middeck Payload Accommodations......Page 701
18.7 Ferry-Flight Accommodations......Page 704
18.8 Optional Services......Page 705
19.1 Introduction......Page 713
19.2 Definitions......Page 714
19.3 Design Environments......Page 719
19.4 Development Thermal Testing......Page 729
19.5 Unit Thermal Testing......Page 731
19.7 System Thermal Testing......Page 746
19.8 Launch Site Thermal Testing......Page 760
19.9 References......Page 761
20.1 Introduction......Page 762
20.2 Technology Drivers......Page 763
20.4 Future Technologies and Innovations......Page 764
20.5 Summary......Page 789
20.6 References......Page 790
Appendix A: Surface Optical Property Data......Page 793
Appendix B: Material Thermal Properties......Page 804
Appendix C: Thermally Conductive Filler Materials and Suppliers......Page 820
C......Page 831
H......Page 832
M......Page 833
S......Page 834
T......Page 835
W......Page 836