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Solidification mechanism transition of liquid Co–Cu–Ni ternary alloy

✍ Scribed by D. Y. Zang; H. P. Wang; F. P. Dai; D. Langevin; B. Wei


Publisher
Springer
Year
2010
Tongue
English
Weight
992 KB
Volume
102
Category
Article
ISSN
1432-0630

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