✦ LIBER ✦

Solid state morphological instability of Ni4Mo precipitates

✍ Scribed by L.A. Nesbit; D.E. Laughlin

Publisher: Elsevier Science
Year: 1981
Tongue: English
Weight: 490 KB
Volume: 51
Category: Article
ISSN: 0022-0248
DOI: 10.1016/0022-0248(81)90310-9

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Fiber Morphology Resulting from Solid St

Fiber Morphology Resulting from Solid State Coalescence of Spherical Precipitates

✍ Mukherjee, K. ;Hsu, Tsing-Wong ;Kato, M. 📂 Article 📅 1984 🏛 John Wiley and Sons 🌐 English ⚖ 448 KB

Silicide formation by solid state reacti

Silicide formation by solid state reaction of Mo-Ni and Mo-Co films with Si(100)

✍ R.S. Rastogi; V.D. Vankar; K.L. Chopra 📂 Article 📅 1991 🏛 Elsevier Science 🌐 English ⚖ 314 KB

The instability of solid-liquid interfac

The instability of solid-liquid interface in MoNi alloy induced by diffusional coherency strain

✍ Won-Hyuk Rhee; Duk N. Yoon 📂 Article 📅 1987 🏛 Elsevier Science ⚖ 712 KB

In an alloy of 85Mo-15Ni by weight prepared by liquid phase sintering for a long time, the relatively large spherical Mo-Ni grains are in chemical equilibrium with the surrounding liquid matrix and are separated from each other by bulk liquid. When the chemical equilibrium between the grain and the

Morphological aspects of polymerization

Morphological aspects of polymerization in the solid state

✍ Grabar, Donald G. ;Chen, Catherine S. Hsia 📂 Article 📅 2007 🏛 Wiley (John Wiley & Sons) ⚖ 163 KB

Kinetic-morphological peculiarities of s

Kinetic-morphological peculiarities of solid-state isomerization of complexes

✍ T. Shakhtshneider; E. Ivanov; V. Boldyrev 📂 Article 📅 1988 🏛 Springer Netherlands 🌐 English ⚖ 468 KB

Growth behavior of Ni3Sn4 layer during r

Growth behavior of Ni3Sn4 layer during reactive diffusion between Ni and Sn at solid-state temperatures

✍ M. Mita; M. Kajihara; N. Kurokawa; K. Sakamoto 📂 Article 📅 2005 🏛 Elsevier Science 🌐 English ⚖ 226 KB

The solid-state reactive diffusion between Ni and Sn was experimentally studied using Sn/Ni/Sn diffusion couples. The diffusion couples were prepared by a diffusion bonding technique and then annealed at temperatures between T = 433 and 473 K for various times in an oil bath with silicone oil. At th