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Soldering in Electronics Assembly

โœ Scribed by Mike Judd and Keith Brindley (Auth.)


Publisher
Butterworth-Heinemann
Year
1992
Tongue
English
Leaves
291
Category
Library

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โœฆ Synopsis


''Soldering in Electronics Assembly'' starts at the bottom and works its way right to the top of this vast technical, yet practical subject. It covers all relevant aspects of the area, looking theoretically at every facet likely to be needed in a detailed study, yet it does so in a most practical manner. The book looks at soldering processes in the light of electronic assembly type, solder, flux and cleaning requirements. Every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wavesoldering and zoned forced convection infra-red machines are covered. Separate chapters consider safety and solder process quality assessment. Other important topics covered are: and a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability; a detailed analysis of soldering process defects and causes. The book is intended for use during industrial construction of electronics assemblies at a professional level. Managers, engineers and technicians involved in the soldering process can use the book as a reference to see the variety of methods available together with an up-to-date discussion of technical concerns

โœฆ Table of Contents


Content:
Front Matter, Page iii
Copyright, Page iv
Preface, Pages ix-xi
Acknowledgements, Page xii
10 rules of machine soldering, Page xiii
1 - Soldering process, Pages 1-20
2 - Electronics assemblies, Pages 21-56
3 - Solder, Pages 57-82
4 - Flux, Pages 83-100
5 - CS soldering processes, Pages 101-132
6 - SC soldering processes, Pages 133-156
7 - Cleaning of soldered assemblies, Pages 157-176
8 - Avoiding problems โ€” soldering quality, Pages 177-198
9 - Standards & specifications, Pages 199-220
Glossary, Pages 221-232
References, Pages 233-234
Further reading, Pages 235-240
Worldwide addresses, Pages 241-248
Appendix 1 - Why not blame the machine?, Pages 249-254
Appendix 2 - Problems & solutions, Pages 255-257
Appendix 3 - Soldering safety, Pages 259-275
Appendix 4 - Comparing soldering processes & machines, Pages 277-281
Index, Pages 282-286


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