Solderable EMI gasket and grounding pad

• Book ID: 104381057
• Publisher: Elsevier Science
• Year: 2009
• Tongue: English
• Weight: 324 KB
• Volume: 2009
• Category: Article
• ISSN: 1350-4789
• DOI: 10.1016/s1350-4789(09)70271-5

✦ Synopsis

seal high buoyancy. The adhesion a between the foam and foil is increased compared to currently available products, in order to prevent de-lamination during the recycling process.