Solderability degradation models for fusible tin alloy coatings on copper substrates

✍ Scribed by Geist, H.; Kottke, M.

• Book ID: 117872527
• Publisher: IEEE
• Year: 1988
• Tongue: English
• Weight: 365 KB
• Volume: 11
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/33.16652