Skin thermal pain modeling—A holistic method
✍ Scribed by F. Xu; T.J. Lu; K.A. Seffen
- Publisher
- Elsevier Science
- Year
- 2008
- Tongue
- English
- Weight
- 1000 KB
- Volume
- 33
- Category
- Article
- ISSN
- 0306-4565
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