𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Size and Substrate Effects upon Undercooling of Pb-Free Solders

✍ Scribed by Yu-chih Huang; Sinn-wen Chen; Kuang-siang Wu

Book ID
107455663
Publisher
Springer US
Year
2009
Tongue
English
Weight
336 KB
Volume
39
Category
Article
ISSN
0361-5235

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Lead-Free Solders: Materials Reliability
Lead-Free Solders: Materials Reliability for Electronics (Subramanian/Lead-Free Solders: Materials Reliability for Electronics) || β€˜Effects of Minor Alloying Additions on the Properties and Reliability of Pb-Free Solders and Joints’
✍ Subramanian, K. N. πŸ“‚ Article πŸ“… 2012 πŸ› John Wiley & Sons, Ltd 🌐 English βš– 633 KB

Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to al