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Sintered copper sponges for use at low temperature

✍ Scribed by D.L. Goodstein; W.D. McCormick; J.G. Dash

Publisher
Elsevier Science
Year
1966
Tongue
English
Weight
173 KB
Volume
6
Category
Article
ISSN
0011-2275

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πŸ“œ SIMILAR VOLUMES

Heat conduction in sintered copper at lo
Heat conduction in sintered copper at low temperatures
✍ D.O. Edwards πŸ“‚ Article πŸ“… 1966 πŸ› Elsevier Science 🌐 English βš– 110 KB

where Sag is the thermoelectric power of the silver normal and amounted to no more than 1 per cent of d V/dT. Values of S obtained in this way have an estimated uncertainty of about 4 per cent. The results are shown in Figure 1, where the solid circles represent the new thermoelectric power data. T

Materials for low temperature use
Materials for low temperature use
✍ J.B. Gardner πŸ“‚ Article πŸ“… 1979 πŸ› Elsevier Science 🌐 English βš– 102 KB
Hafniumβ€”glass seals for use at very low
Hafniumβ€”glass seals for use at very low temperatures
✍ J. Lees; P.W. Matthews πŸ“‚ Article πŸ“… 1970 πŸ› Elsevier Science 🌐 English βš– 271 KB

turns per layer) of 4-5 mil (0.11 mm)enamelled copper wire held in place with GE 7031 cement. Thermal contact to the glycerine CMN slurry inside the coil was achieved by silver soldering a braid of about 100 4" 5 mil bare copper 752 75~ 755 i, 752 752.