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Simulations of thermal conductance across tilt grain boundaries in graphene

✍ Scribed by Peng Wang, Bo Gong, Qiong Feng, Hong-Tao Wang

Book ID: 118794261
Publisher: The Chinese Society of Theoretical and Applied Mechanics; Institute of Mechanics, Chinese Academy of Sciences
Year: 2012
Tongue: English
Weight: 400 KB
Volume: 28
Category: Article
ISSN: 0567-7718
DOI: 10.1007/s10409-012-0166-8

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