✦ LIBER ✦
Simulation of recrystallization grain growth during re-aging process in the Cu–Ni–Si alloy based on phase field model
✍ Scribed by Yong-qiang Long; Ping Liu; Yong Liu; Wei-min Zhang; Jian-sheng Pan
- Book ID
- 113791921
- Publisher
- Elsevier Science
- Year
- 2008
- Tongue
- English
- Weight
- 758 KB
- Volume
- 62
- Category
- Article
- ISSN
- 0167-577X
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