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Simulation of flow excursion and thermal siphon under natural circulation condition with lower pressure and lower quality

✍ Scribed by Wang, Jianjun ;Yang, Xingtuan ;Jiang, Shengyao


Book ID
107476789
Publisher
Higher Education Press and Springer
Year
2008
Tongue
English
Weight
197 KB
Volume
2
Category
Article
ISSN
1673-7393

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