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Silver migration in thick film conductors and chip attachment resins: M. V. Coleman and A. E. Winster. Microelectronics J. 12 (4), 23 (1981)

Book ID: 108362091
Publisher: Elsevier Science
Year: 1982
Tongue: English
Weight: 99 KB
Volume: 22
Category: Article
ISSN: 0026-2714
DOI: 10.1016/s0026-2714(82)80533-7

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