✦ LIBER ✦
Siliconizing formation mechanism and its property by slurry pack cementation on electro-deposited nickel layer into copper matrix
✍ Scribed by Hongxing Wang; Chenglin Chu; Xiaobo Sheng; Pinghua Lin; Yinsheng Dong
- Book ID
- 107403943
- Publisher
- Wuhan University of Technology
- Year
- 2009
- Tongue
- English
- Weight
- 420 KB
- Volume
- 24
- Category
- Article
- ISSN
- 1000-2413
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