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Significant enhancement of bond strength in the accumulative roll bonding process using nano-sized SiO2 particles

✍ Scribed by Cheng Lu; Kiet Tieu; David Wexler


Book ID
108178986
Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
559 KB
Volume
209
Category
Article
ISSN
0924-0136

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