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Shear strength development of the phenol–formaldehyde adhesive bond during cure

✍ Scribed by Matej Jost; Milan Sernek

Publisher
Springer
Year
2008
Tongue
English
Weight
398 KB
Volume
43
Category
Article
ISSN
0043-7719

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Application of dielectric analysis for m
Application of dielectric analysis for monitoring the cure process of phenol formaldehyde adhesive
✍ Milan Sernek; Frederick A. Kamke 📂 Article 📅 2007 🏛 Elsevier Science 🌐 English ⚖ 238 KB

Dielectric analysis (DEA) was conducted for continuous in-process monitoring of the curing of phenol formaldehyde (PF) adhesive. The influence of wood moisture content (MC) on the dielectric signal obtained in the PF adhesive bond was examined. The cure kinetics of the PF adhesive was evaluated at f