Semiconductor Manufacturing Handbook (McGraw-Hill Handbooks)

✍ Scribed by Hwaiyu Geng

Publisher: McGraw-Hill Professional
Year: 2005
Tongue: English
Leaves: 871
Edition: 1
Category: Library

No coin nor oath required. For personal study only.

✦ Synopsis

This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines.

✦ Table of Contents

Cover......Page 1
PART 1: SEMICONDUCTOR
FUNDAMENTALS
AND BASIC MATERIALS......Page 2
CHAPTER 1 HOW SEMICONDUCTOR CHIPS ARE MADE......Page 4
CHAPTER 2
IC DESIGN......Page 14
CHAPTER 3
SILICON SUBSTRATES
FOR SEMICONDUCTOR
MANUFACTURING......Page 22
CHAPTER 4
COPPER, LOW-k DIELECTRICS,
AND THEIR RELIABILITY......Page 38
CHAPTER 5
FUNDAMENTALS OF SILICIDE
FORMATION ON Si......Page 52
CHAPTER 6
PLASMA PROCESS CONTROL......Page 62
CHAPTER 7
VACUUM TECHNOLOGY......Page 80
CHAPTER 8
PHOTOMASK......Page 94
PART 2: WAFER PROCESSING......Page 102
CHAPTER 9 MICROLITHOGRAPHY......Page 104
CHAPTER 10
ION IMPLANTATION AND RAPID
THERMAL PROCESSING......Page 128
CHAPTER 11
WET ETCHING......Page 144
CHAPTER 12
PLASMA ETCHING......Page 152
CHAPTER 13
PHYSICAL VAPOR DEPOSITION......Page 178
CHAPTER 14
CHEMICAL VAPOR DEPOSITION......Page 200
CHAPTER 15
EPITAXY......Page 216
CHAPTER 16
ECD FUNDAMENTALS......Page 234
CHAPTER 17
CHEMICAL MECHANICAL
POLISHING......Page 246
CHAPTER 18
WET CLEANING......Page 260
PART 3: FINAL MANUFACTURING......Page 274
CHAPTER 19 INSPECTION, MEASUREMENT,AND TEST......Page 276
CHAPTER 20
GRINDING, STRESS RELIEF,
AND DICING......Page 322
CHAPTER 21
PACKAGING......Page 344
PART 4: NANOTECHNOLOGY,
MEMS, AND FPD......Page 398
CHAPTER 22 NANOTECHNOLOGY AND NANOMANUFACTURING......Page 400
CHAPTER 23
FUNDAMENTALS OF
MICROELECTROMECHANICAL
SYSTEMS......Page 412
CHAPTER 24
FLAT-PANEL DISPLAY
TECHNOLOGY AND
MANUFACTURING......Page 440
PART 5: GASES AND CHEMICALS......Page 454
CHAPTER 25 SPECIALTY GAS AND CDA SYSTEMS......Page 456
CHAPTER 26
WASTE GAS ABATEMENT
SYSTEMS......Page 484
CHAPTER 27
PFC ABATEMENT......Page 502
CHAPTER 28
CHEMICAL AND SLURRY
HANDLING SYSTEMS......Page 516
CHAPTER 29
FLUID HANDLING COMPONENTS
FOR HIGH-PURITY LIQUID
CHEMICALS AND SLURRIES......Page 538
CHAPTER 30
FUNDAMENTALS OF
ULTRAPURE WATER......Page 560
PART 6: FAB YIELD, OPERATIONS,
AND FACILITIES......Page 576
CHAPTER 31 YIELD MANAGEMENT......Page 578
CHAPTER 32
AUTOMATED MATERIAL
HANDLING SYSTEM......Page 596
CHAPTER 33
CD METROLOGY AND CD-SEM......Page 608
CHAPTER 34
SIX SIGMA......Page 620
CHAPTER 35
ADVANCED PROCESS CONTROL......Page 636
CHAPTER 36
ENVIRONMENTAL, HEALTH, AND
SAFETY CONSIDERATIONS IN
SEMICONDUCTOR
FABRICATION FACILITIES......Page 658
CHAPTER 37
PLAN, DESIGN, AND
CONSTRUCTION OF A FAB......Page 676
CHAPTER 38
CLEANROOM DESIGN
AND CONSTRUCTION......Page 702
CHAPTER 39
MICRO-VIBRATION
AND NOISE DESIGN......Page 738
CHAPTER 40
ESD CONTROLS IN CLEANROOM
ENVIRONMENTS......Page 772
CHAPTER 41
AIRBORNE MOLECULAR
CONTAMINATION......Page 792
CHAPTER 42
PARTICLE MONITORING
IN SEMICONDUCTOR
MANUFACTURING......Page 816
CHAPTER 43
WASTEWATER NEUTRALIZATION
SYSTEMS......Page 840

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Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. Thoroughly Revised, State-of-the-Art Semiconductor Design, Manufacturin