Self-Heating Effect on Bias-Stressed Reliability for Low-Temperature a-Si:H TFT on Flexible Substrate

✍ Scribed by Shih-Chin Kao; Hsiao-Wen Zan; Jung-Jie Huang; Bo-Cheng Kung

• Book ID: 114619909
• Publisher: IEEE
• Year: 2010
• Tongue: English
• Weight: 491 KB
• Volume: 57
• Category: Article
• ISSN: 0018-9383
• DOI: 10.1109/ted.2009.2039261