✦ LIBER ✦
Self-Assembly Process to Integrate and Connect Semiconductor Dies on Surfaces with Single-Angular Orientation and Contact-Pad Registration
✍ Scribed by W. Zheng; H. O. Jacobs
- Book ID
- 101413695
- Publisher
- John Wiley and Sons
- Year
- 2006
- Tongue
- English
- Weight
- 330 KB
- Volume
- 18
- Category
- Article
- ISSN
- 0935-9648
No coin nor oath required. For personal study only.