Selective electroless Ni deposition on a TiW underlayer for integrated circuit fabrication

✍ Scribed by V.M. Dubin; S.D. Lopatin; V.G. Sokolov

• Publisher: Elsevier Science
• Year: 1993
• Tongue: English
• Weight: 829 KB
• Volume: 226
• Category: Article
• ISSN: 0040-6090
• DOI: 10.1016/0040-6090(93)90210-g