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Selective electroless copper metallization on a titanium nitride barrier layer

✍ Scribed by J.C. Patterson; M. O'Reilly; G.M. Crean; J. Barrett

Publisher: Elsevier Science
Year: 1997
Tongue: English
Weight: 471 KB
Volume: 33
Category: Article
ISSN: 0167-9317
DOI: 10.1016/s0167-9317(96)00032-9

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