Selection of TiN as the Interconnect Material for Measuring the Electrical Conductivity of Polymer-Derived SiCN at High Temperatures

✍ Scribed by Hee-Yeon Ryu; Rishi Raj

• Book ID: 109260055
• Publisher: John Wiley and Sons
• Year: 2007
• Tongue: English
• Weight: 196 KB
• Volume: 90
• Category: Article
• ISSN: 0002-7820
• DOI: 10.1111/j.1551-2916.2006.01345.x